Basic Tools and Equipments, Basic Electronics.
Basic Cellphone Accessories.
Basic Jumpering Technique. Basic Hot air Technique. Basic Trouble Hardware Shooting.
BASIC TOOLS AND EQUIPMENTS
1. precision set of screwdrivers - opening tools T5, T6, T7 2. Tweezers a. bend tip - ideal for replacing I.C.
b. straight tip - ideal for backlighting, jumpering
3. cleaning materials and solutions a. eraser - for removing stains/clean contacts usually for keypad malfunctions. b. toothbrush - for removing stains from eraser and others c. lacquer thinner - for first aide for water damaged d. flux inject - for reheating a component e. ensenso - for reheating, ideal for begginners f. alcohol 70% solution - alternative sol'n 4 lacqueer g. lighter fluid - 4. analog multi tester a. DCV10 - for voltage testing direct current b. X1 - for continuity testing,jumpering
5. Soldering iron with stand 2 pieces 20 or 30 watts 6. Soldering lead .03mm- for Resoldering cold solder's. 7. Soldering paste - for cleaning soldering tips, etc
8. Dessoldering wire - substitute for dessoldering pump to remove excess lead in the pcb
9. Maintenance plate-used to hold the pcb and to avoid ESD- electro static discharge 10. BGA plate (ball grid array) - for reballing I.C. serve as molder for balls of I.C. 11. spatula- for applying bga paste to bga plate, used for reballing ic. 12. bga paste - soldering paste in a form of paste for reballing 13. magnifying lamp with lens - for small components to identify small parts. 14. regulated power supply variable - for battery shock, battery replacement.., etc 15. jumper wire double coated wire- for lost connection problem
16. hot air (rework station)- for removing/ resoldering small components, IC, etc 17. cutter plier 18. long nose plier 19. cutter blade 20. repair manual with schematic diagram vol. 2 nokia series BACK TO TOP
1. RESISTOR - an electronic device that resist the flow of current in a given circuit. PHYSICAL APPEARANCE SCHEMATIC DIAGRAM SYMBOL
2. CAPACITOR - an electronic device that store electrical charge in a given circuit. PHYSICAL APPEARANCE SCHEMATIC DIAGRAM SYMBOL
3. INDUCTOR - an electronic device that induce current in a given circuit. PHYSICAL APPEARANCE SCHEMATIC DIAGRAM SYMBOL
4. TRANSISTOR - an electronic device that acts like a switch and amplify. PHYSICAL APPEARANCE SCHEMATIC DIAGRAM SYMBOL
5.
INTEGRATED CIRCUIT (IC) - A complex set of electronic components and
their interconnections that are etched or imprinted onto a tiny slice of
semiconducting material. PHYSICAL APPEARANCE SCHEMATIC DIAGRAM SYMBOL
6. RFPA (Radio frequency power amplifier) - an electronic device that amplify to produce a signal. PHYSICAL APPEARANCE SCHEMATIC DIAGRAM SYMBOL
REFER TO DIAGRAM IT IS ALMOST THE SAME WITH THE INTEGRATED IC
7. FREQUENCY BANDS 900MHZ 1800MHZ 1900MHZ 850MHZ
8. FREQUENCY BANDS PACKAGES a. SINGLE BAND - 900MHZ ex. 5110,6110
b. DUAL BAND - 900MHZ/1800MHZ ex. 3210,3100, 7650
C. TRI BAND - 900MHZ/1800MHZ/1900MHZ ex. 6600
D. QUAD BAND - 850MHZ /900MHZ/1800MHZ/1900MHZ ex. N70 BACK TO TOP Chapter 3
CELLPHONE ACCESSORIES 1. SWITCH - an electronic device that used to power on and off the phone 2. SPEAKER - an electronic device that converts electrical impulse to audio waves 3. MICROPHONE - an electronic device that converts audio waves to electrical impulse. 4. BUZZER - an electronic device that has an armature inside to produce sound. 5. VIBRA MOTOR - an electronic device that has an armature inside to produce vibration. 6. LCD- Liquid crystal display ESD- Electrostatic discharge Electrostatic discharge is a serious issue in solid state electronics, such as integrated circuits. Integrated circuits are made fromsemiconductor materials such as silicon and insulating materials such as silicon dioxide. Either of these materials can suffer permanent damage when subjected to high voltages; as a result, there are now a number of antistatic devices that help prevent static build up.
ESD PREVENTION 1. HOLD PCB AT THE SIDE 2. USE MAINTENANCE PLATE 3. DISCHARGE ESD IN THE BODY 4. DISCHARGE CAPACITOR BACK TO TOP
JUMPERING TECHNIQUE(basic) materials needed:
soldering iron 20 watts 2 pcs soldering stand 2 pcs soldering lead jumper wire or magnetic wire soldering paste
BACKLIGHTING PROCEDURE 1.) Get the mapping of the pcb backlight. ex. 3310
LCD LED
KEYPAD LED
2.) Get the polarity of the bulb. 3.) Install backlight according to their polarity and their pcb mapping.
note: do not mix high resistance bulb to low resistance bulb.
types of connection: a.) series connection b.) parallel connection activity: 1. install backlight at flat surface board 2. install backlight at hanged surface board
3. make a jumper
Rework Station "HOT AIR"
Materials: a.) Hot air b.) Tweezzer Bend or Straight tip c.) Maintenance Plate d.) Ensenso/flux e.) PCB
Activity: 1. Reheat/resolder/reconnect small components ex. resistor,capacitor,inductor 2. Reheat/reconnect Spider type IC 3. Reheat/Reconnect BGA type IC
HARDWARE TROUBLE SHOOTING INFORMATION NEEDED IN CELLPHONE REPAIR
(objective: student must know how to take down notes for their repairs )
1. HISTORY (WHAT HAPPEN TO THE PHONE/HARDWARE/SOFTWARE)
2. SERIAL NO. (IMEI *#06#)
(objective: to be able to identify the types of repairs and phone problems)
MINOR REPAIRS 1. NO AUDIO RECEPTION DIAGNOSIS REMEDY a.) SPEAKER/EARPIECE a.) TEST/LIFT PINS/REPLACE b.) SPEAKER INTERFACE b.) CLEAN W/ERASER c.) SMALL COMPONENTS c.) REHEAT/REPLACE d.) LOST CONNECTION d.) RECONNECT/JUMPER
note: use schematic diagram to check the connection and small components. from audio ic to speaker interface
e.) AUDIO IC (COBBA) e.) REHEAT/REBOLL/REPLACE f.) BP (board problem) f.) RTO (return to owner)
note: before RTO try software trouble shooting first
2. NO AUDIO TRANSMISSION DIAGNOSIS REMEDYa.) MIC/MOUTH PIECE a.) TEST /LIFT PINS/REPLACE b.) MIC INTERFACE b.) CLEAN W/ERASER c.) SMALL COMPONENTS c.) REHEAT/REPLACE d.) LOST CONNECTION d.) RECONNECT/JUMPER
note: use schematic diagram to check the connection and small components. from audio ic to mic interface
e.) AUDIO IC (COBBA) e.) REHEAT/REBOLL/REPLACE f.) BP (board problem) f.) RTO (return to owner)
note: before RTO try software trouble shooting first
3. NO RING TONE DIAGNOSIS REMEDYa.) BUZZER a.) TEST/LIFT PINS/REPLACE b.) BUZZER INTERFACE b.) CLEAN W/ERASER c.) SMALL COMPONENTS c.) REHEAT/REPLACE d.) LOST CONNECTION d.) RECONNECT/JUMPER
note: use schematic diagram to check the connection and small components. from UI ic to buzzer interface
e.) AUDIO IC (COBBA) e.) REHEAT/REBOLL/REPLACE f.) BP (board problem) f.) RTO (return to owner)
note: before RTO try software trouble shooting first
4. DISPLAY MALFUNCTION DIAGNOSIS REMEDY a.) LCD a.) REPLACE IF DAMAGED b.) LCD INTERFACE b.) CLEAN/VOLTAGE TEST /JUMPER d.) LOST CONNECTION d.) RECONNECT/JUMPERc.) SMALL COMPONENTS c.) REHEAT/REPLACE
note: use schematic diagram to check the connection and
e.) POWER IC (CCONT) e.) REHEAT/REBOLL/REPLACE
small components. from POWER IC to LCD interface f.) BP (board problem) f.) RTO (return to owner)
note: before RTO try software trouble shooting first
5. KEYPAD MALFUNCTION DIAGNOSIS REMEDY a.) CASING a.) FIT PROPERLY /REPLACE b.) KEYPAD INTERFACE b.) CLEAN W/ERASER c.) SMALL COMPONENTS c.) REHEAT/REPLACE d.) LOST CONNECTION d.) RECONNECT/JUMPER
note: use schematic diagram to check the connection and small components. from CPU to KEYPADTRANSISTOR JUMPER TO GROUPMATES
e.) UPP/CPU (IF NECESSARY) e.) REHEAT/REBALL/REPLACE f.) BP (board problem) f.) RTO (return to owner)
note: before RTO try software trouble shooting first
6. INSERT SIM CARD DIAGNOSIS REMEDY a.) SIMCARD a.) TEST /REPLACE IF DAMAGED b.) LCD INTERFACE b.) CLEAN/VOLTAGE TEST /JUMPER c.) SMALL COMPONENTS c.) REHEAT/REPLACE d.) LOST CONNECTION d.) RECONNECT/JUMPER
note: use schematic diagram to check the connection and small components. from POWER IC to SIMCARD interface
e.) POWER IC (CCONT) e.) REHEAT/REBOLL/REPLACE f.) BP (board problem) f.) RTO (return to owner)
note: before RTO try software trouble shooting first
MAJOR REPAIRS 1. HANGING/AUTO SHUT OFF DIAGNOSIS REMEDY a.) BATTERY a.) TEST /SHOCK/ REPLACE b.) BATTERY TERMINAL b.) LIFT PINS/RESOLDER/REPLACE c.) BATTERY INTERFACE c.) CHECK IF SHORTED d.) SMALL COMPONENTS d.) REHEAT/REPLACE e.) LOST CONNECTION e.) RECONNECT/JUMPER
note: use schematic diagram to check the connection and small components. from BATTERY interface and power lines check legend of diagrams for power supply flow
f.) POWER IC (CCONT) f.) REHEAT/REBOLL/REPLACE RF PROCESSOR (HAGAR) AUDIO IC (COBBA) FLASH IC/MEMORY IC RAM IC g.) CRYSTAL OSCILLATOR g.) REHEAT/ REPLACE REALTIME CLOCK h.) BP (board problem) h.) RTO (return to owner)
note: before RTO try software trouble shooting first
2. WATER DAMAGED
1. DIS ASSEMBLE THE UNIT 2. SOAK WITH LACQUER THINNER BRUSH SLIGHTLY 3. AIR DRY USING HOT AIR SET AIR: 8 HEATER: 2 OR 3 4. ASSEMBLE THE UNIT 5. TEST. IF PHONE STILL NO POWER FOLLOW THE PROCEDURE OF NO POWER
3. CONTACT SERVICE (CS) USE UFS(TWISTER FLASHER) TO DETECT THE ERROR OF CONTACT SERVICE
IF
COBBA SERIAL IS 000000 TRY TO UPDATE THE PHONE FIRST DOUBLE CLICK
SET FAID IF STILL CS TRY TO FLASH THE PHONE INPUT MCU AND PPM. IF PHONE
STILL CS TRY TO REHEAT/REPLACE COBBA. IF STILL NO LUCK CPU IS THE
PROBLEM.
IF SERIAL NUMBER OR IMEI IS OOOOOOOO OO POSSIBLE
PROBLEM IS FLASH IC/MEMORY IC /RAM TRY TO FLASH IF STILL NO LUCK
REPLACE FLASH IC. IF STILL NO LUCK CPU IS THE PROBLEM.
4. NOT CHARGING DIAGNOSIS REMEDY a.) CHARGER a.) TEST / REPLACE b.) BATTERY b.) TEST/ SHOCK/ REPLACE c.) BATTERY TERMINAL c.) LIFT PINS/ RESOLDER/ REPLACE d.) BATTERY INTERFACE d.) CHECK IF SHORTED e.) CHARGING PINS e.) LIFT PINS/ RESOLED/ REPLACE f.) CHARGING INTERFACE f.) CLEAN W/ ERASER g.) SMALL COMPONENTS g.) REHEAT/REPLACE h.) LOST CONNECTION h.) RECONNECT/JUMPER note: use schematic diagram to check the connection and small components. check positive BATTERY terminal interface and power lines, power ic to charging ic and charging interface. check legend of diagrams for power supply flow.
i.) CHARGING IC i.) REHEAT/REBALL/REPLACE POWER IC (CCONT) j.) BP (board problem) j.) RTO (return to owner)
note: before RTO try software trouble shooting first
5. NO POWER DIAGNOSIS REMEDY a.) BATTERY a.) TEST /SHOCK/ REPLACE b.) BATTERY TERMINAL b.) LIFT PINS/ RESOLDER/REPLACE c.) BATTERY INTERFACE c.) CHECK IF SHORTED d.) SWITCH (S401) d.) TEST/REPLACE e.) SMALL COMPONENTS e.) REHEAT/REPLACE f.) LOST CONNECTION f.) RECONNECT/JUMPER
note: use schematic diagram to check the connection and small components. from BATTERY interface and power lines check legend of diagrams for power supply flow
g.) POWER IC (CCONT)(N201) g.) REHEAT/REBALL/REPLACE RF PROCESSOR (HAGAR) AUDIO IC (COBBA) FLASH IC/MEMORY IC RAM IC h.) CRYSTAL OSCILLATOR h.) REHEAT/ REPLACE REALTIME CLOCK i.) BP (board problem) i.) RTO (return to owner)
note: before RTO try software trouble shooting first
6. NO SIGNAL DIAGNOSIS REMEDY a.) SIMCARD a.) REPLACE IF DAMAGED/ TEST b.) ANTENNA b.)REPLACE IF DAMAGED c.) ANTENNA SWITCH c.) REHEAT/TEST BY JUMPER/REPLACE d.) FILTERS /COUPLERS d.) REHEAT/REPLACE e.) SMALL COMPONENTS e.) REHEAT/REPLACE f.) LOST CONNECTION f.) RECONNECT/JUMPER
note: use schematic diagram to check the connection and small components. Check legend for signal flows rx and tx flows. g.) RF PROCESSOR (HAGAR) g.) REHEAT/REBALL/REPLACE AUDIO IC (COBBA ) POWER IC (CCONT)(N201) FLASH IC/MEMORY IC RAM IC REALTIME CLOCK h.) CRYSTAL OSCILLATOR h.) REHEAT/ REPLACE i.) BP (board problem) i .) RTO (return to owner)
note: before RTO try software trouble shooting first TX (TESTING OF TRANSMISSION) PRESS : # AND CALL ...... REQUESTING GOOD: RESULT UNKNOWN /REQUEST NOT COMPLETED DEFFECTIVE: NOT DONE/ NO NETWORK COVERAGE
RX (TESTING OF RECEPCION) PRESS: MENU + SETTINGS + PHONE SETINGS + NETWORK SELECTION + MANUAL ..... SEARCHING GOOD: 2 TO 3 NETWORKS DEFFECTIVE: 1 NETWORK /NO NETWORK FOUND
TIPS: FLUCTUATING SIGNALS REHEAT REPLACE FILTERS/COUPLERS SIGNAL DROPS AFTER 10 SECONDS: AUDIO IC/PA REHEAT OR REPLACE
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